MediaTek Helio P60

The MediaTek Helio P60 was announced at MWC in February 2018 as the first MediaTek chip with a multi-core AI processing unit (Mobile APU) and NeuroPilot AI technology. Built on TSMC's 12 nm FinFET process, it combines four Arm Cortex-A73 and four Cortex-A53 cores at up to 2.0 GHz with a Mali-G72 MP3 GPU at 800 MHz, and MediaTek rated its CPU and GPU about 70 percent faster than the Helio P23 and P30. The APU delivers up to 280 GMAC/s, and the chip has three ISPs supporting 24 MP + 16 MP dual cameras or a single 32 MP camera, 20:9 Full HD+ displays, LPDDR4X memory up to 8 GB and an LTE Cat-7 modem with dual 4G VoLTE.