MediaTek Helio X30

The MediaTek Helio X30 (MT6799) was unveiled at MWC on February 27, 2017 as MediaTek's flagship smartphone chip and its first built on a 10 nm process, with phones from Q2 2017. Its ten cores are arranged in three clusters: two Arm Cortex-A73 cores at 2.5 GHz, four Cortex-A53 cores at 2.2 GHz and four Cortex-A35 cores at 1.9 GHz. It uses an Imagination PowerVR Series7XT Plus GPU at 800 MHz, two 14-bit ISPs for 16 MP + 16 MP dual cameras with 2x optical zoom, and an LTE Cat-10 modem with three-carrier downlink aggregation. MediaTek claimed more than 50 percent power savings over the Helio X20. It was the last chip of the Helio X series.