CPUSmartphoneReleased 2026

MediaTek Dimensity 8550

8C/8T · 3.4 GHz

The MediaTek Dimensity 8550 is a premium 5G smartphone chip introduced in May 2026 as an AI-focused refresh of the Dimensity 8500, debuting in the Honor 600 Pro. Built on TSMC's 4 nm N4P process, it uses an all-big-core CPU of eight Arm Cortex-A725 cores (one at 3.4 GHz, three at 3.2 GHz and four at 2.2 GHz) with 6 MB of L3 cache, an eight-core Arm Mali-G720 GPU and quad-channel LPDDR5X-9600 memory. Its MediaTek NPU 880 adds an LLM Booster and support for Google Gemini Nano V3.

General

Manufacturer: MediaTek
Model: MediaTek Dimensity 8550
Segment: Smartphone
Generation: Dimensity 8000
Codename: MT6899Z_T/TZA
Architecture: ARM64
Microarchitecture: 1× Cortex-A725 + 3× Cortex-A725 + 4× Cortex-A725 (all-big-core)
Release date: 2026
Price: Search on Amazon

Cores & clocks

Cores / threads: 8 cores / 8 threads
Base clock: —
Boost clock: 3.40 GHz
TDP (design W): —
Unlocked: ✕ No
L2 cache: 3.5 MB
L3 cache: 6 MB
Technology (nm): 4 nm
TSMC N4P

Platform

Socket: —
2-CPU (multi-socket): ✕ No
Integrated GPU: Mali-G720 MC8
Memory type: LPDDR5X-9600
4-channel
Memory size: —
ECC memory: —
PCIe: —

Instructions & AI

Instruction extensions: Armv9.2-A
NPU: MediaTek NPU 880

OS support

Notes: Android smartphone platform. MediaTek ships it with Android and provides no Windows, ChromeOS or desktop Linux support; mainstream Linux distributions publish no official image for this SoC.

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