Qualcomm
CPUEmbeddedReleased Sep 1, 2026

Qualcomm Dragonwing IQ-2390

4C/4T · 1.9 GHz

First member of Qualcomm's IQ2 series of industrial edge AI processors, introduced in September 2026 ahead of IFA Berlin. A Cortex-A78 and three Cortex-A55 cores are joined by a SiFive E61 RISC-V real-time microcontroller, Adreno 704 graphics, a 1.1 TOPS Hexagon NPU and two TSN-capable Gigabit Ethernet ports, all rated for a -30 to 115 °C junction temperature range. It is aimed at compact controllers for industrial automation, oil and gas, utilities and energy, with a 10-year supply commitment and evaluation kits due in early 2027.

General

Manufacturer
Qualcomm
Model
Qualcomm Dragonwing IQ-2390
Segment
Embedded
Generation
Qualcomm Dragonwing
Codename
—
Architecture
ARM64
Microarchitecture
1× Cortex-A78 + 3× Cortex-A55 (+ SiFive E61 RISC-V MCU)
Release date
Sep 1, 2026
Price
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Cores & clocks

Cores / threads
4 cores / 4 threadsP1+E3
Base clock
—
Boost clock
1.90 GHz
TDP (design W)
—
Unlocked
✕ No
L2 cache
—
L3 cache
0.5 MB
Technology (nm)
—

Platform

Socket
—
2-CPU (multi-socket)
✕ No
Integrated GPU
Qualcomm Adreno 704
Clock: 1,100 MHz
Memory type
LPDDR4X-3600 (2×16-bit)
2-channel
Memory size
Up to 8 GB
ECC memory
—
PCIe
PCIe 2.0 (1 lane)

Instructions & AI

Instruction extensions
—
NPU
Qualcomm Hexagon NPU — 1.1 TOPS

OS support

Linux
Ubuntu
Notes
Qualcomm supports Android, Yocto Linux and Ubuntu on the Arm cores, with Zephyr RTOS on the RISC-V real-time MCU where fitted. Windows, macOS and ChromeOS are not supported.

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