CPUSmartphoneReleased Feb 25, 2025

MediaTek Dimensity 7400

8C/8T · 2.6 GHz

The MediaTek Dimensity 7400 is a 4 nm 5G smartphone SoC announced in February 2025 together with the Dimensity 6400 and the flip-foldable Dimensity 7400X. It raises the Dimensity 7300's Cortex-A78 cores to 2.6 GHz, and MediaTek claims 15 percent faster AI from its NPU 655. The Imagiq 950 ISP supports 200 MP cameras and 4K30 HDR video, and the chip offers 144 Hz Full HD+ displays, a 3.27 Gbps 5G modem with 3CC carrier aggregation, tri-band Wi-Fi 6E and Bluetooth 5.4.

General

Manufacturer: MediaTek
Model: MediaTek Dimensity 7400
Segment: Smartphone
Generation: Dimensity 7000
Codename: MT6878V/TZA
Architecture: ARM64
Microarchitecture: 4× Cortex-A78 + 4× Cortex-A55
Release date: Feb 25, 2025
Price: Search on Amazon

Cores & clocks

Cores / threads: 8 cores / 8 threadsP4+E4
Base clock: —
Boost clock: 2.60 GHz
TDP (design W): —
Unlocked: ✕ No
L2 cache: —
L3 cache: —
Technology (nm): 4 nm
TSMC N4

Platform

Socket: —
2-CPU (multi-socket): ✕ No
Integrated GPU: Mali-G615 MC2
Clock: 1,300 MHz
Memory type: LPDDR4X, LPDDR5-6400
2-channel
Memory size: —
ECC memory: —
PCIe: —

Instructions & AI

Instruction extensions: Armv8.2-A
NPU: MediaTek NPU 655

OS support

Notes: Android smartphone platform. MediaTek ships it with Android and provides no Windows, ChromeOS or desktop Linux support; mainstream Linux distributions publish no official image for this SoC.

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