CPUSmartphoneReleased 2024

MediaTek Dimensity 7025

8C/8T · 2.5 GHz

MediaTek Dimensity 7025 is a smartphone processor from MediaTek in the Dimensity 7000 series (codename MT6855V/ATZA). Release: 2024. Microarchitecture: 2x Cortex-A78 + 6x Cortex-A55. Process: TSMC N6. Configuration: 8C. Integrated GPU: IMG BXM-8-256. The octa-core CPU pairs two Cortex-A78 cores at up to 2.5 GHz with six Cortex-A55 cores at 2.0 GHz, and the IMG BXM-8-256 graphics run at up to 950 MHz. It supports LPDDR5 and LPDDR4X memory with UFS 3.1 storage, camera sensors up to 200 MP, a 2520 x 1080 display at 120 Hz, sub-6 GHz 5G with dual 5G standalone, Wi-Fi 5 and Bluetooth 5.2, making it a mainstream 5G platform for mid-range handsets.

General

Manufacturer: MediaTek
Model: MediaTek Dimensity 7025
Segment: Smartphone
Generation: Dimensity 7000
Codename: MT6855V/ATZA
Architecture: ARM64
Microarchitecture: 2× Cortex-A78 + 6× Cortex-A55
Release date: 2024
Price: Search on Amazon

Cores & clocks

Cores / threads: 8 cores / 8 threadsP2+E6
Base clock: —
Boost clock: 2.50 GHz
TDP (design W): —
Unlocked: ✕ No
L2 cache: —
L3 cache: —
Technology (nm): 6 nm
TSMC N6

Platform

Socket: —
2-CPU (multi-socket): ✕ No
Integrated GPU: IMG BXM-8-256
Clock: 950 MHz
Memory type: LPDDR5-5500, LPDDR4X-4266
Memory size: —
ECC memory: —
PCIe: —

Instructions & AI

Instruction extensions: —
NPU: None

OS support

Notes: Android smartphone platform. MediaTek ships it with Android and provides no Windows, ChromeOS or desktop Linux support; mainstream Linux distributions publish no official image for this SoC.

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